Event
October 18 - 21, 2026
Chicago

Wiliot will be at PACK EXPO International 2026, October 18–21 in Chicago.

Join us at one of the largest packaging and processing events in the world to explore cutting-edge innovations, emerging technologies, and solutions shaping the future of packaging and supply chains.

Stop by Booth W-17116 to connect with our team and discover how our Physical AI platform and Gen3 IoT Pixels can unlock powerful data and real-time insights across your operations.

Interested in meeting with Wiliot at the event?
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